Small BGA pad PCB:

Layers: 4 Layer
PCB material: FR4 High Tg(S1000-2)
Board Thickness: 0.6mm
Surface Finishing: 
Finished Copper thickness:1/1/1/1 oz

Special Technology:

•  Minimum trace width/space: 3/3mil(0.08mm)
•  Small BGA pad: 3.9mil(0.1mm)
•  Minimum vias diameter: 6mil(0.15mm)

Standard PCB Capability:

Minimum Circuit Trace Width/Space: 2.7/2.7mil

the Minimum Via Size: 0.15mm

the Minimum legend Height/Width: 0.5mm/0.12mm

Surface Finishing: HASL-LF, ENIG,ENEPIG,OSP,Gold Finger,Hard Gold Plating,Immersion Silver,Immersion Tin

Special Technology: Blind&buried via, Via In Pad,Backdrill,Small BGA Pad,Impedance control,Heavy Copper,Copper Filled Vias,Countersink hole,Depth Milling

Material Type: FR4,Metal Core,Halogen Free FR4,Rogers,PTFE,Arlon,Nelco,Polyimide

Final Board Thickness: 0.4mm ~ 6.0mm

Final Copper Thickness: HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ

FR4 Substrate Thickness: 0.1mm 0.2mm 0.3mm 0.4mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm 1.5mm 2.0mm 2.36mm

Shaping: CNC Routing,Punching,V-CUT, Depth milling, Castellation

Special Hole: Blind&buried hole,Depth milling,T-slot,Countersink hole

Quick-turn Lead Time: 1 Day for 2 Layer PCB, 2 Days for 4 Layer PCB, 3 Days for 6 Layer PCB