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Quick Details

Off State Leakage Current: 1 μA
Standards Met: UL 508 Approved File No E69938
Length: 19.91mm
Brand: IXYS
Switching Type: DC
Operating Temperature Range: -40 → +85°C
Mounting Type: PCB Mount
Special Features: Arc-Free With No Snubbing Circuits, High Reliability, Low Drive Power Requirement, Machine Insertable, No EMI/RFI Generation, Wave Solderable
Dimensions: 19.914 x 5.029 x 26.162mm
Capacitance: 1.1nF
Package Style: ISO Plus-264
Relay Type: Power Relay
Terminal Type: PCB Pin
Contact Configuration: SPNO
Height: 26.16mm
Number of Poles: 1
Maximum Turn On Time: 25 ms
Depth: 5.03mm
Output Device: MOSFET
Maximum Load Current: 2.7 A rms/A dc

Specifications

These single pole solid state relays have normally open (1-Form-A) contacts. They feature a unique ISOPLUS-264 package giving the highest possible load current and power ratings. They are able to provide 2500 Vrms of input to output isolation by utilising optically coupled MOSFET technology.

The optically coupled outputs use the well-known OptoMOS architecture and are controlled by a highly efficient infrared LED. With a low on-resistance and a high load current rating these units are suitable for a wide variety of applications.

The unique ISOPLUS-264 package is manufactured with the silicon chip being soft soldered onto the Direct Copper Bond (DCB) substrate rather than the traditional copper lead frame. These DCB ceramics are what makes it possible to provide 2500 Vrms isolation but still offer a very low junction-to-case thermal resistance from only 0.3C per watt.

Potential Applications:
Industrial controls/motor control
Robotics
Medical equipment: Patient/equipment isolation
Instrumentation: Multiplexers, data acquisition, electronic switching and I/O subsystems
Energy meters
Transportation equipment
Aerospace/defence
Features
2.25 Arms load current with 5°C per watt heat sink
Low on-resistance
Selection of blocking voltages
2500 Vrms input/output isolation
Low thermal resistance
Isolated, low thermal impedance ceramic pad for heat sink applications
Low drive power requirements
Arc-free with no snubbing circuits
No EMI/RFI generation
Machine insertable, wave solderable