| Width: | 5.33mm |
|---|---|
| Contact Material: | Beryllium Copper |
| Brand: | TE Connectivity |
| Minimum Operating Temperature: | -55°C |
| Maximum Operating Temperature: | +105°C |
| Length: | 40.51mm |
| Housing Material: | Thermoplastic |
| Pin Type: | Stamped |
| Contact Plating: | Tin |
| Termination Method: | Solder |
| Orientation: | Vertical |
| Dimensions: | 40.51 x 5.33 x 17.63mm |
| Mounting Type: | Through Hole |
| Number Of Contacts: | 32 |
| Row Width: | 15.24mm |
| Pitch: | 2.54mm |
| Depth: | 17.63mm |
| Frame Type: | Closed Frame |
Quick Details
Specifications
DIPLOMATE Dual Leaf (DL) DIP sockets with stamped and formed dual wiping contacts for vertical, through hole PCB mounting. These DIPLOMATE Dual Leaf (DL) DIP sockets have black thermoplastic GF stackable housings with a 2.54mm centreline, and a "true closed bottom" design which prevents solder or flux wicking and standoffs to allow board clearance for cleaning after soldering. The profiles for these DIPLOMATE Dual Leaf (DL) DIP sockets are all standard apart from part number 719-8817 which has an over-the-component profile. These DIPLOMATE DIP sockets are available with different frame styles with either straight or retention legs.