This QFP socket has been designed for late prototyping or early production applications, allowing up to 20 insertion cycles of the device without risk of contact degradation or lead damage. The footprint of the socket mirrors that of the device, enabling the socket to be dispensed with favour of direct soldering, without any further changes to the PCB design. Insulator is high temperature thermoplastic. Contacts are copper alloy with tin over nickel plating
Contact resistance 30mΩ (at 10mA)
Current rated 500mA per contact
Flammability UL 94 V-0
Operating temperature -25C to +85C
Temperature for reflow soldering 220C for 60 seconds
Insulation resistance 500mΩ (at 150Vdc)
Surface Mount