2 mm DF59 Series wire to board crimp socket housings with a compact space saving design and a low profile mating height of 2.48 mm. These DF59 crimp housings use a swing lock mechanism when mated which incorporates both positive and friction locks. A positive locking mechanism secures the housing to the header providing a tactile click when the lock is securely engaged. A complete electrical connection is then made by the friction lock mechanism which also produces a tactile click when fully engaged. This swing lock mechanism provides a secure connection and prevents accidental unmating caused by severe wiring and mechanical stress. The contacts for these DF59 series crimp housings must be purchased separately.
• Compact, space saving design
• Low profile mated height of 2.48 mm
• Swing lock mechanism incorporates positive and friction locks for secure connection
• High operating temperature of up to 105°C