Connector System: | Wire to Board |
---|---|
Contact Material: | Brass |
Brand: | Molex |
Contact Plating: | Gold |
Termination Method: | Solder |
Shrouded/Unshrouded: | Unshrouded |
Current Rating: | 3A |
Series: | C-GRID III |
Mounting Type: | Through Hole |
Number Of Contacts: | 12 |
Number Of Rows: | 2 |
Body Orientation: | Straight |
Pitch: | 2.54mm |
Quick Details
Specifications
90120, 90121, 90122 and 90131 series PCB headers that form part of the 2.54 mm C-Grid III interconnection system designed to meet the latest industry requirements. These C-Grid III PCB headers mate with C-Grid III series PCB sockets and crimp housings for use in both board to board and wire to board applications. The headers have a breakaway design and can be cut to size for additional design flexibility. The pins of these PCB pin headers have a high retention force for a secure mating connection. The contacts, once soldered to the PCB also have a high mechanical stability. These 2.54 mm C-Grid PCB pin headers are available in single and dual row, vertical and right angle mounting configurations to suit a range of interconnection requirements.
Suitable for use in board to board and wire to board applications
Breakaway feature for design flexibility
High pin retention force for secure mating connection
High mechanical stability once soldered
Suitable for use in board to board and wire to board applications
Breakaway feature for design flexibility
High pin retention force for secure mating connection
High mechanical stability once soldered