| Connector System: | Board to Board, Board to FPC |
|---|---|
| Contact Material: | Copper Alloy |
| Brand: | Hirose |
| Contact Plating: | Gold |
| Termination Method: | Solder |
| Current Rating: | 300mA |
| Series: | DF23 |
| Mounting Type: | Surface Mount |
| Number Of Contacts: | 10 |
| Number Of Rows: | 2 |
| Body Orientation: | Straight |
| Pitch: | 0.5mm |
Quick Details
Specifications
Hirose DF23 series 0.5mm Pitch Low-Profile Board-to-Board / Board-to-FPC Connectors
• 1.5 mm board-to-board distance
• Click sensation
• High contact reliability
• Large self-alignment
• Board placement with automatic equipment
• 1.5 mm board-to-board distance
• Click sensation
• High contact reliability
• Large self-alignment
• Board placement with automatic equipment