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Quick Details

Brand Name: Dowell
Design Printing: No Printing
Adhesive Type: Pressure Sensitive
Adhesive: Acrylic
Adhesive Side: Single Sided
Model Number: DL-300
Place of Origin: China (Mainland)
Feature: Waterproof
Use: Carton Sealing
Material:
Type: UV Protective Film
Color: Transparent,blue,white,black and white
Thickness: 0.02-0.15mm++
Product name: UV Film
Width: 20-1650mm
Length: 20~200m
Application: Protection of various surface
Size: Custom Size Accepted

Specifications

UV Dicing tape UV Release Dicing No Residue Tape for Wafer Back Grinding ESD Semiconductor WaferTape

UV Release Dicing  No Residue  Tape for Wafer Back Grinding  ESD Semiconductor WaferTape UV Dicing Film

Product Description

UV Dicing tape UV Release Dicing No Residue Tape For Wafer Back Grinding ESD Semiconductor WaferTape 
UV Dicing tape UV Release Dicing No Residue Tape For Wafer Back Grinding ESD Semiconductor WaferTape  

 

 

Name

 UV reslease film  UV dicing tape  dicing film

 Brand

 Dowell Protective film

 Feature

 1. after UV curing, the adhesion is very low, and no residue left after removal.

2. Have quick UV reaction time, it can improving efficiency.

3. Before UV curing it has good and reliable adhesion, to protect when cutting.

4. Special structure design is beneficial to tool life.

 Thickness

  0.02~0.2mm

 Material 

  Polyethylene or PET

 Viscosity removal method

Need ultraviolet light illuminate

Caution

 Avoid exposure to the sun

usage

 UV dicing tape is suitable for: glass cutting protection, polishing, grinding, development, cutting process, small area copper foil and PCB cutting process

 

RUV Dicing tape UV Release Dicing No Residue Tape For Wafer Back Grinding ESD Semiconductor WaferTape


 


 

 

about UV release tape

the UV release film can be used for wafer grinding and cutting, ceramic passive components and LED radiator substrate ceramic wafer cutting process, glass substrate polishing and cutting process, so that wafers and other components do not fall off during the grinding and cutting process. after the processing of dispersed exposure to ultraviolet light, the tape is easy to strip from the workpiece; Or the UV tape can temporarily protect the wafer surface from scratches and damage during manufacturing, storage, and transportation of the wafe Can be customized according to clients' requirement.


 

UV Dicing tape UV Release Dicing No Residue Tape For Wafer Back Grinding ESD Semiconductor WaferTape

Company Information

 UV Dicing tape UV Release Dicing No Residue Tape for Wafer Back Grinding ESD Semiconductor WaferTape

Packaging & Shipping

 UV Dicing tape UV Release Dicing No Residue Tape for Wafer Back Grinding ESD Semiconductor WaferTape

FAQ

 

Q1:how could I buy the products I need if there is no price in the website?

A: You can send your inquiry to us about the products you need,our sales will reply you within 24 hours to help you make the order.

Q2:how long could I get reply of my inquiry?

A:You will get a reply within 24 hours.

Q3: What kind of warranty do you offer?

A:  Product offer quality warranty.

Q4:What kind of payment methods do you have as a manufacturer?

A: We take T/T, Western union, L/C and Cash as payment terms

Q5:how long will it take to deliver goods?

A: We will start preparing goods when we get your bank receipt. the package will be shipped out in 2-10working days after we get your payment.

Q6: What kind of packaging you offer?

A: during the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.