Machine Type: | Other |
---|---|
Material: | Metal / Coil |
Certification: | RoHS |
Brand Name: | CRF |
Condition: | New |
Machine Type: | plasma cleaning,surface treatment |
Industry Used: | |
Cleaning Type: | |
Cleaning Process: | |
Use: | |
Fuel: | Electric |
Feature: | plasma cleaningsurface treatment, |
Model Number: | CRF-VPO-2L-S |
Place of Origin: | China (Mainland) |
Power: | 1000W/40KHz |
Capacity: | 10L |
Quick Details
Specifications
Sing Fung Interlligent Manufacturing(CRF plasma) Main sale plasma cleaning machine, vacuum plasma cleaning machine, plasma surface treatment equipment and other technical equipment.The machine can support custom design.
Plasma Cleaning Machine Company Brand on-line vacuum plasma cleaning machine plasma surface treatment machine:
Vacuum plasma processing system CRF-VPO-2L-S
Name
Vacuum plasma processing system
Model
CRF-VPO-2L-S
Control system
PLC+touch screen
Power supply
380V/AC,50/60Hz, 3kw
RF Power
1000W/40KHz
Capacity (Volume)
10L(Option)
Number of layers (Electrode of plies)
2(Option)
Cavity specifications (Area)
220(W)*230(D)*230(H)
Gas channel (Gas)
Two working gas options: Ar, N2, CF4, O2
Features
Large processing space, increase processing capacity, adopt PLC+touch screen control
System, accurately control equipment operation;
the capacity and number of layers of the equipment cavity can be customized according to
Customer requirements to meet customer needs; maintenance and repair costs are low,
Which is convenient for customer cost control;
High precision, fast response, good controllability and compatibility, perfect functions
and professional technical support.
Scope of application
Vacuum plasma cleaning machine is suitable for printed circuit board industry,
Semiconductor IC field, silica gel, plastic, polymer field, automotive electronics
Industry, aviation
Empty industry and so on. Printed circuit board industry: high-frequency board surface
Activation, multi-layer board surface cleaning, de-drilling, soft board, soft-hard
Combined board surface cleaning, Desmearing, activation before soft board reinforcement.
Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before bonding and
Welding; silicon
Surface roughening, etching and activation of silica gel, plastic and polymer in the
Field of glue, plastic and polymer.
Plasma Cleaning Machine Company Brand on-line vacuum plasma cleaning machine plasma surface treatment machine:
Vacuum plasma processing system CRF-VPO-2L-S
Name
Vacuum plasma processing system
Model
CRF-VPO-2L-S
Control system
PLC+touch screen
Power supply
380V/AC,50/60Hz, 3kw
RF Power
1000W/40KHz
Capacity (Volume)
10L(Option)
Number of layers (Electrode of plies)
2(Option)
Cavity specifications (Area)
220(W)*230(D)*230(H)
Gas channel (Gas)
Two working gas options: Ar, N2, CF4, O2
Features
Large processing space, increase processing capacity, adopt PLC+touch screen control
System, accurately control equipment operation;
the capacity and number of layers of the equipment cavity can be customized according to
Customer requirements to meet customer needs; maintenance and repair costs are low,
Which is convenient for customer cost control;
High precision, fast response, good controllability and compatibility, perfect functions
and professional technical support.
Scope of application
Vacuum plasma cleaning machine is suitable for printed circuit board industry,
Semiconductor IC field, silica gel, plastic, polymer field, automotive electronics
Industry, aviation
Empty industry and so on. Printed circuit board industry: high-frequency board surface
Activation, multi-layer board surface cleaning, de-drilling, soft board, soft-hard
Combined board surface cleaning, Desmearing, activation before soft board reinforcement.
Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before bonding and
Welding; silicon
Surface roughening, etching and activation of silica gel, plastic and polymer in the
Field of glue, plastic and polymer.