Sing Fung Interlligent Manufacturing(CRF plasma)(en.Sfi-crf.
   Com) main plasma cleaning machine, vacuum plasma cleaning machine, plasma surface treatment equipment and other technical equipment.The machine can support custom design.  
.a.          shaobo@sfi-crf.
.a.         com,

Vacuum plasma cleaning equipment modification machine:
Vacuum plasma processing system CRF-VPO-4L-S

Name

Vacuum plasma processing system

Model

CRF-VPO-4L-S

Control system

PLC+touch screen

Power supply

380V/AC,50/60Hz, 3kw

RF Power

1000W/40KHz/13.56MHz

Capacity (Volume)

30L(Option)

Number of layers (Electrode of plies)

4(Option)

Effective processing area (Area)

200(L)*150(W)(Option)

Gas channel (Gas)

Two working gas options: Ar, N2, CF4, O2

Features
Large processing space, increase processing capacity, adopt PLC+touch screen control system, accurately control equipment operation;
the capacity and number of layers of the equipment cavity can be customized according to customer requirements to meet customer needs; maintenance and repair costs are low, which is convenient for customer cost control;
High precision, fast response, good controllability and compatibility, perfect functions and professional technical support.
 
Scope of application
Vacuum plasma cleaning machine is suitable for printed circuit board industry, semiconductor IC field, silica gel, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high-frequency board surface activation, multilayer board surface cleaning, de-drilling dirt, soft board, soft-hard combined board surface cleaning, de-drilling dirt, activation before soft board reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before bonding and welding; silica gel, plastic, polymer field silica gel, plastic, polymer plasma surface roughening, etching, and activation.