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Machine Type: Other
Material: Metal / Coil
Certification: CE
Brand Name: TONSON
Condition: New
Machine Type: plasma cleaning machine
After-sales Service Provided: Engineers available to service machinery overseas
Industry Used: Electronic Industry
Cleaning Type: High Pressure Cleaner
Cleaning Process: Vapor Cleaning
Use: Sterilizing / Disinfecting
Fuel: Electric
Feature: Critical Cleaning / Residue Free
Model Number: TS-PL100
Place of Origin: China (Mainland)
Material: imported 316 stainless steel
Power: 1000w
Power frequency: 40khz/13.56mhz
Volume: 60L/100L/150L/200L
Vacuum degree: 5-90pa
Vacuum pump: oil pump/dry pump+roots combination
Cleaning time: 1-100min
Gas channel: two-way working gas:oxygen and argon
Control mode: PLC+touch screen

Specifications

Semiconductor Wire Bonding Plasma Cleaner with Vacuum Pump vacuum plasma cleaning machine
Model TS-PL30MA/60MA/110MA/150MA/180MA/200MA
Cavity material 316 stainless steel/imported aluminum alloy(optional)
Power frequency 40KHz/13.56MHz
Power TS-PL60MA/110MA                                  0-500W(Adjustable)
TS-PL150MA/180MA/200MA              0-1000W(Adjustable)
Treatment layers 11/15/17/17/21
Vacuum degree 0-100pa(adjustable)
Gas Flow control 0-500SCCM(MFC+-2%)
Electrode ceramics Imported high frequency ceramics
Gas channel Two-way(addable):Ar,N,H,CF,Oxygen
System control software Self-developed V2.0
Control mode PLC+touch screen
Vacuum cavity temperature Less than 30
Vacuum pump Oil pump/dry Pump(optional)+roots combination
Capacity 30L/60L/110L/150L/180L/200L
Cavity dimensions(LxWxH)mm 400*450*400mm
500*450*500mm
500*500*600mm
500*600*600mm
600*580*700mm
Overall dimensions(LxWxH)mm 1000*1030*1630mm
1100*1030*1680mm
1200*1100*1730mm
1200*1200*1730mm
1250*1230*1790mm
Application Glass,Touch green,Material science,Printing,Paper manufacturing,Ink coating,Medicine & healthcare,Thin film polymer,Electronic
Circuit,Textile fibre
,Chemistry and chemical industry,Petrochemical Industry.
Feature A.Highly stable and applicable to large scale continuous production.
B.Special electrode structure to ensure plasma evenness.
C.Applicable to the products of all shapes,high generality.
D.Self-developed integrated control system software is easy  to operate.
E.Highly safe,multi-functional safety protection
F.the cavity dimensions and layers can be customized to satisfy Customers"diversified demands

Semiconductor Wire Bonding Plasma Cleaner with Vacuum Pump vacuum plasma cleaning machineSemiconductor Wire Bonding Plasma Cleaner with Vacuum Pump vacuum plasma cleaning machineSemiconductor Wire Bonding Plasma Cleaner with Vacuum Pump vacuum plasma cleaning machineSemiconductor Wire Bonding Plasma Cleaner with Vacuum Pump vacuum plasma cleaning machine