Diamond Resin Bond Wheels are designed for fast and cool cutting; perform well in both wet and dry grinding applications. For grinding and finishing of ceramics; precision grinding on carbide dies, rolls and carbide wear parts and other hard-to-grind materials.

 

 Bond systems available for either wet and dry, or wet applications. for grinding and finishing of ceramics; grinding tungsten carbide, cermets, ceramic thermal spray coatings, polycrystalline diamond (PCD) and glass; grinding of carbide Tipped and inserted tools such as saws, cutters, reamers, endmills, etc.;

 precision grinding on carbide dies, rolls and carbide wear parts...

 

Applications:

Roll grinding and grinding/dimensioning of thermal spray coatings, (including tungsten carbide, chrome carbide and chrome oxide), ceramics, carbides, chilled iron composites and other hard-to-grind materials.

 

Specifications:

 1A1600*50*304.8*10

 1A1750*40*305*10
1A1750*75*305*10
14A1750*100*305*10*75
1A1800*40*305*10
1A1900*40*305*10
1A1915*50*305*10

Description: 

Resin Diamond Bond and CBN Grinding Wheel are used in used for cutting and grinding and grinding Hard material. these wheels are widely appreciated in the market for excellent Cutting efficiency. We offer these wheels to the clients in variety of sizes and specifications. Our wheels can be attached with various types of Tools. 

Main Features: 

Resin bonded wheels Have the features of high self-sharpening ability, high cutting efficiency; Good finishing, low heat dissipation and no burn on workpiece. It is very Suitable for high efficiency and precision grinding of most of workpiece. 

Application:  

Diamond wheel: Tungsten carbide, ceramic, glass, magnetic materials, silicon materials, powder Metallurgy, thermal spraying alloy etc. Application of CBN wheel: high speed Steel, stainless steel, die steel, cast steel etc. We offer different kinds of Resin bond wheel, diameter range:6~500mm, the thickness of wheel: 1~300mm, grit Size: 30/35~W3.5, and offer the special wheel as per customer`s requirements.