| Size: | 6A2T |
|---|---|
| Type: | Abrasive Disc |
| Brand Name: | Moresuperhard |
| Material: | diamond |
| Grit: | 3000 |
| Model Number: | 6A2T |
| Place of Origin: | China (Mainland) |
Quick Details
Specifications
Diamond Wheels for Surface Grinding Various Wafer
Application: back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, gallium arsenide, GaN wafers, silicon-based chips, etc
Grinding Machines: NTS, SHUWA, ENGIS, Okamoto, Disco, TSK and STRASBAUGH, etc
Bonded: Vitrified bond & Resin bond
Diameter (mm): 200mm, 250mm, 280mm, 300mm, 350mm
Grinding Machines: NTS, SHUWA, ENGIS, Okamoto, Disco, TSK and STRASBAUGH, etc
Bonded: Vitrified bond & Resin bond
Diameter (mm): 200mm, 250mm, 280mm, 300mm, 350mm
Silicon wafer back grinding
Manufacturing Processes for Silicon Wafers
Ingot, cropping, Peripheral grinding, Ingot slicing, double disc grinding or lapping, edge grinding, surface grinding, polishing, back grinding, dicing, chips......
Ingot, cropping, Peripheral grinding, Ingot slicing, double disc grinding or lapping, edge grinding, surface grinding, polishing, back grinding, dicing, chips......
Applications of back grinding wheel
Back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, gallium arsenide, GaN wafers, silicon-based chips, etc
Applicable Grinding Machine
the back grinding wheels can be used for the Japanese,German, American, Korean and other grinders. Such as NTS, SHUWA, ENGIS, Okamoto, Disco, TSK and STRASBAUGH grinding machine, etc