| Size: | 6A2T |
|---|---|
| Type: | Abrasive Disc |
| Brand Name: | Moresuperhard |
| Material: | diamond |
| Grit: | 3000 |
| Model Number: | 6A2T |
| Place of Origin: | China (Mainland) |
Quick Details
Specifications
Back Grinding Wheel for LED Substrate
Application: LED industry for back grinding of sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers
Grinding Machines: NTS, SHUWA, ENGIS, Okamoto, Disco, TSK and STRASBAUGH, etc
Bonded: Vitrified bond & Resin bond
Diameter of Back Grinding Wheel: 200mm, 250mm, 280mm, 300mm, 350mm
Diameter of Epitaxial Wafer: 2", 4", 6"
LED epitaxial wafer back grinding wheel
LED industry for back grinding of sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers. It works well with European, American, Japanese and Chinese grinding machines with an excellent performance and cost effectiveness.
Applicable Grinding Machine
the back grinding wheels can be used for the Japanese,German, American, Korean and other grinders ( Such as NTS, SHUWA, ENGIS, Okamoto, Disco, TSK and STRASBAUGH grinding machine, etc ).
Advantages of back grinding wheel for various wafer
* with low damage and high quality
* Nodeless consecutive processing is possible by the superior sharpness
* It helps minimize processing damage, improve processing efficiency and reduce processing cost, and is customizable according to customer needs
* Cool polished section
* Good surface finishes
Specification of back grinding wheel
| Model | D (mm) | T (mm) | H (mm) |
6A2/6A2H |
175 | 30, 35 | 76 |
| 200 | 35 | 76 | |
| 350 | 45 | 127 | |
6A2T |
195 | 22.5, 25 | 170 |
| 280 | 30 | 228.6 | |
6A2T(three ellipses) |
350 | 35 | 235 |
| 209 | 22.5 | 158 |