| Surface Finishing: | ENIG |
|---|---|
| Board Thickness: | 1.6 |
| Copper Thickness: | 1 |
| Base Material: | FR4 |
| Brand Name: | Hitech |
Quick Details
Specifications
Power bank PCBA Printed circuit board assembly China manufactor
Technical description
4Layer Rigid PCB
Material: FR4 Tg170
Finish thickness: 1.6mm
Copper thickness: 1/1/1/1 Oz
Minimum width/spacing: 0.15/0.15mm
Minimum via diameter: 0.30mm
Surface finish: HASL LF
Solder mask: Green
Legend: White
OEM generation material
4Layer Rigid PCB
Material: FR4 Tg170
Finish thickness: 1.6mm
Copper thickness: 1/1/1/1 Oz
Minimum width/spacing: 0.15/0.15mm
Minimum via diameter: 0.30mm
Surface finish: HASL LF
Solder mask: Green
Legend: White
OEM generation material