Material 

3" 4" 6"  LT wafer Saw/Optical grade  

Orientation

X112°/Y28°/Y36°/Y42°/YZ or Customized 

Curie Temp 

605°C±3°C

Doped with 

Fe

Surface finish 

Single or double sides polish (DLP/SLP/ SSP/DSP all available ) 

Thickness 

0.18/0.25/0.35/0.50/1.00 mm

TTV

<1~5m

BOW

± (25m ~40um )

Warp

<= 35m

LTV (5mmx5mm)

<1.5 um

PLTV(<0.5um)

≥98% (5mm*5mm)  with 2mm edge excluded

Edge 

Compl't with SEMI M1.2 with GC800# .Regular at C typed

Orientation flats 

Available, per request

Polished side Ra 

Roughness Ra<=5A

Back Side Criteria 

Roughness Ra:0.5-1.0m GC#1000

Edge Rounding

Compliant with SEMI M1.2 Standard/refer to IEC62276

Cracks, saw marks, stains

 None