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Brand Name: BonTek
Product Series: QZ
Semiconductor Type: Quartz Crystal
Manufacturing Technology: Wafer
Diameter: 50 - 200mm

Specifications

Material Characteristics

Material

Piezo   / Optical grade   

Q-Value 

Min 1.8x10^6, 2.4x10^6 to   3.0x10^6    IEC standards

ECD 

Max 2 /c, 10/c, Max 30/c,  Max 100/c, Max   300/c;  Swept   Quartz

Inclusions Density 

Ia, Ib, I, II, III Grades

Swept 

both Pure Z and Y Bar   available, with or without Swept quartz


Processing capacity - blanks

Cuts   Type (orientation) 

X,   Y, Z, at, BT, CT, ET,DT, GT, NT, FC, SC, IT, AC, BC, ST, TS  MT,NT RT, LC, etc 

Angle Tolerance(±) 

Theta Angle: ±5, ±10, ±15,   ±30, ±1, ±2,, etc.

Phi Angle:   ±5, ±10, ±15, ±30,, etc.

Size   

Round (3.0mm8" )/ Square   (1.6x1.6mm48x48mm or larger)/ SMD (1.2x2.4mm above)

Size   Tolerance(±) 

±0.01mm,+/-0.005mm,   +/-0.0005mm, according to size

Frequency/   Thickness 

1 Mhz up to 54Mhz for   at-Cut Fundamental; up to 70Mhz by Etching 

Flat   

Per   requested: the flat shall be perpendicular to X axis within ±10 deg 

Surface   Finishing 

#1000(9u); #2000(7u);   #3000(5u); #4000(3u) (Sic); Polished(Cerium oxide)&   etched  Std 

Overtone 

Fundamental;   Third Overtone (3rd); Fifth Overtone (5th)

Contouring   (dioptric) 

Plano-Convex :   0.5 dioptric10 dioptric  Bi-Convex:   10 dioptric15 dioptric


Processing capacity - wafers

Diameter 

3" (76.2mm)

4" (100mm)

6" (150mm)

8" (200mm)

Thickness 

0.08mm Min-up

0.10mm   Min-up

0.20mm Min -up

0.35mm   Min-

Primary   Flat 

22mm

32mm

42.5mm

57.5mm   or notch

Surface 

LTV (5mmx5mm)

<1.5m

TTV

<1.5~3   m

Bow

-30<bow<30

Warp

<40m

Surface Type

SSP   / DSP

Edge Criteria

R=0.2mm   or Bullnose

Polished   side Ra

<0.5nm or per   requested

Back   Side Criteria

General is 0.2-0.5m or   as customized

 


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