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Brand Name: BonTek
Product Series: GL
Semiconductor Type: Fused Silica/Quartz
Manufacturing Technology: Wafer
Diameter: 25.4 - 325mm

Specifications

Material Brand


Schott

Borofloat33 / BK7 / B270 / D263 etc.


Corning

Eagle XG, Fused Silica 7980 / 7978 / 7979 etc.


Feilihua

Fused Silica JGS1 / JGS2 & Single quartz etc.


O'hara

SK-1300


GM

H-K9L / Soda Lime etc.

 

Processing Capacity

SpecIfication

unit

3"

4"

5"

6"

8"

12"

Diameter (or Square) 

mm

76.2

100

125

150

200

300

Tol(±) 

mm

<0.1~0.25 mm

Thinnest Thickness 

mm

>0.10

>0.18

>0.30

>0.30

>0.30

>0.50

Primary Flat 

mm

22

32.5

42.5

57.5/notch

notch

notch

LTV (5mmx5mm)

m

<2

<2

<2

<2

<2

<10

TTV

m

<8

<10

<15

<20

<30

<30

Bow

m

±20

±25

±40

±40

±60

±60

Warp

m

<30

<40

<50

<50

<60

<60

PLTV(<0.5um)

%

≥95%(5mm*5mm)

Transmittance


UV, Optical, IR or Custom option 

Edge Rounding

mm

Compliant with SEMI M1.2 Standard/refer to IEC62276

Surface Type


Single Side Polished /Double Sides Polished

Polished side Ra

nm

<1.0nm or specific per requested

Back Side Criteria

m

General is 0.2-0.5m or as customized

Appearance

Contamination

None

Particles >0.3m

<=30

Saw Marks, striations

None

Scratch

None

Cracks, crowsfeel saw marks, stains

None

 
Fused Silica Fused Quartz Borosilica Substrate
Fused Silica Fused Quartz Borosilica Substrate