the effective alloying methods widely used in industry are thick filmProcessing andMo-MN processing. Thick filmProcessing Is to pressure-weld theParticles of precious metals, thenGlue to the ceramic via molten glass.THerefore, the conductivity of thick film islower than copper. AlthoughMo-MN processIng can makethe metal layerwithHigh conductivity, the metal layer is usually very thin(Less than25μm), which limits the surge-resistant capability of the high-powerComponents. Therefore, thereOught to be a new method of CombiningMetal andCeramic to improve the conductivity of metal layer and the ability to withstand large current andReduce the contact thermal resistance between metal layer and ceramic with less complex process.DBC isApplied the industrial electronics Such asHigh-power Electricity semiconductor modules, automotive electronics, solar panel Components, laser, etc.