DPC isAlso called direct copper plating substrate. FIrst,Laser Is used to drill and scribe ceramic substrate. THen, cOpper is plated on the ceramic substrateby the means of vacuum coating after being washed. Next, the circuit is made in the way of photolithography or laser development.Finally, the metalizing circuit is finished byIncrease the thickness of the circuit by the means ofElectroplatingor electroless Plating Sedimentation.Compared with the traditional thick film process, such as LTCC, HTCC and DBC,DPC is advantageous inHigher thermal conductivity is, deformable material, stable process, controllable thickness of metal layer and high resolution of the line.

       ApplicationsFields are LED, high-power electricity semiconductor modules, semiconductor refrigerators, electronic heaters, power controllers, power hybrid circuits, intelligent power components, solid-state relays, automotive electronics, aerospace and military eLectronic components, sOlar panels Components, aNtennas in telecommunication and fIlters.