| Chemical Composition: | Tantalum |
|---|---|
| Material: | Tantalum |
| Shape: | Target |
| Application: | Electronics, Industrial, Chemical |
| Brand Name: | ZZOK |
| Dimensions: | As required |
| Place of Origin: | China (Mainland) |
Quick Details
Specifications
| Material Type | Tantalum |
| Symbol | Ta |
| Atomic Weight | 180.94788 |
| Atomic Number | 73 |
| Color/Appearance | Gray Blue, Metallic |
| Thermal Conductivity | 57 W/m.K |
| Melting Point (°C) | 3,017 |
| Coefficient of Thermal Expansion | 6.3 x 10-6/K |
Tantalum Sputtering Targets
Tantalum is a dark (blue-gray) metal with high density, good ductile, and highly conductive heat and electricity. since tantalum can form thin oxides and the film has a protective effect, tantalum is widely used as a base material in the manufacturing process of electrolytic capacitors. Tantalum sputtering targets are applied in microelectronic fields, such as thermal ink-jet print head, copper plating, and through-silicon via technology. since high-temperature inks can cause cavitation in some ink-jet printing machines, the tantalum sputtering target can be the anti-cavitation films to protect the ink facilities. Some tantalum sputtering targets are also applied in the glass coating.
Tantalum Sputtering Targets
Purity: 99.95%-99.99%
Circular: Diameter <= 14 inch, Thickness >= 1mm
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm
Targets Type: Planar sputtering target, Rotary sputtering target
More Information on Tantalum Sputtering Targets
Tantalum Sputtering Targets
Purity: 99.95%-99.99%
Circular: Diameter <= 14 inch, Thickness >= 1mm
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm
Targets Type: Planar sputtering target, Rotary sputtering target
| Applications Optical films Electronic Semiconductor Diffusion barrier layer |
Features High purity Grain refined, Engineered microstructure ( the average grain size < 100 um) |
| Manufacturing Process Melting Multiple step electron beam melting (EB) Analysis (GDMS, ICP-OES, LECO) Grain refinement Thermomechanical treatment (Forging, Rolling, Annealing) Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment |
Options 99.95% minimum purity Smaller sizes also available for R&D applications Sputtering target bonding service |
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FAQ
Q: Can you keep the unit price unchanged as last time?
A:the price of our products fluctuates according to the price of raw material, maybe rise or fall,Even there are great fluctuates, we will try to keep our best price for you.
Q: how many production facilities do you have in your factory?
A: According to production process, we have powder Mixing equipment; 3 sets of
Isostatic Press Machine; Mould process machines;10 Medium frequency sintering furnaces;5 vacuum sintering furnaces; 2 Electron beam ingot furnaces,2 Electron beam horizontal furnaces;forging and rolling machines; 10 CNC machines and Rolling machine/Drawing machine/Polishing machine,etc.
Q: how to guarantee the quality?
A:We have advanced production equipment such as isostatic press machine, medium frequency sintered furnace. and we also have many professional inspection equipment, such as chemical analysis machine, physical performance machine metallo scope, browett hardness tester.
with these equipments, we could guarantee the quality very well.
Q: Can you make the product with my design?
A: Yes, we can,we supply customized service.You can send us all the details of what you need,then we will provide Detailed quotation.