| Brand Name: | PROSYSTEMS |
|---|---|
| color: | WHITE |
| Elongation at Break: | >3000UPH, an average cycle is less than 1.5 |
| Min. Bending Radius: | Host: L1450mm * W 800mm * H 1360mm |
| Consistency of rod: | Capacity3000-3200UPH |
| Model Number: | PRO360 |
| Place of Origin: | China (Mainland) |
Quick Details
Specifications
Model No.: PRO360
Product Type: Fully Automated IC Programming Equipment
Trademark: PROSYSTEMS
Technical specifications
1.New four-nozzle system: four vacuum nozzles, each operating independently of the other, for a capacity of up to 3000UPH.
2.New servo-screw architecture: increase machine running speed, increase operating space, all work stations within reach.
3.Equipment system accuracy: X-axis ±0.02mm; Y-axis ±0.02mm; Z-axis ±0.05mm; P-axis ±0.05mm U(θ) axis ±0.15 degrees.
4.Motorised press block system: adjustable press block opening speed, flexible and swift action, adjustable downward pressure height without overpressure, enhanced SOCKET life.
5.Double CCD positioning system: with high precision upper and lower CCD positioning system, positioning accuracy ±0.02mm, to meet the very small size of the product accurate pick and place.
6.Multi-mode feeding and unloading: support TRAY Tray to Tray, Tray to Tape, Tape to Tape, support simultaneous placement of 15-20 TRAY trays; support 8-24MM carrier tape.
7.Multifunctional marking platform: support optional ink dotting, laser dotting system, ink spraying system, lableFeeder labelling system.
8.Intelligent system interaction: support optional tray and braided tape AOI inspection to provide final inspection for products, and production messages can be interacted with MES intelligence in real time.
9.Support for a wide range of IC packages: SOP, SSOP, TSSOP, PLCC, QFN, LQPF, BGA, etc.