|
|
Item |
Processing |
Value |
|
|
Base Material |
TG |
135 |
|
|
|
|
150 |
|
|
|
|
170 |
|
|
|
|
200 |
|
|
|
|
250 |
|
|
|
CTI |
600 |
|
|
|
Ceramics |
4350/5880/TMM10/TC600 |
|
|
|
Teflon |
Taikang Niko/ Wang Ling |
|
|
|
Metal Material |
Copper/Aluminum |
|
|
Technology |
Layer |
1-32 layers |
|
|
|
Surface Threatment |
HAL(Lead/Lead Free),Immersion Gold,Gold Plated,IG+OSP,IG+Gold Fingers,Peelable Blue Mask,Carbon Ink |
|
|
|
Drilling |
Power Drill:Hole Diameter≥0.15mm |
|
|
|
|
Laser Drill:Hole Diameter≥0.1mm |
|
|
|
|
Min. Half Hole:≥0.5mm |
|
|
|
|
Min. Slot Hole:0.65mm |
|
|
|
|
Tolerrance :PTH:+/-0.075mm Pressure welding Hole:+/-0.05mm NPTH+/-0.05mm |
|
|
|
Aspect Ratio (thickness/hole diameter) |
16:01 |
|
|
|
Line Width/Spacing |
≥3.5mil |
|
|
|
Board Thickness |
0.2mm to 3.2mm |
|
|
|
Board Thickness Tolerrance |
0.2mm to 1.0mm:+/-0.1mm; ≥1.0mm:+/-10% |
|
|
|
Finish Copper Thickness |
Inner/Outer Layer 1 ~3OZ |
|
|
|
Solder Mask |
Photosensitve Ink |
|
|
|
Resist Bridge |
Green Oil≥4mil,Moltley ≥6mil |
|
|
|
Solder Plug Hole |
Via Hole/ink/resin stopper |
|
|
|
Board size |
Max.:500*1200mm;Min.:5*5mm |
|
|
|
Resistance Tolerance |
±5Ω(50Ω),±10%(≥50Ω) |
|
|
|
Compression |
Pure FR4,FR4+Ceramics,FR4+Aluminum,FR4+Copper |
