Qianli MEGA-IDEA PCB soldering platform for Phone X/XR/XS/XS Max/11/11 Pro/11 Pro Max IC chips BGA separation, Qianli motherboard thermostatic preheater for Phone X-11 Pro Max logic board soldering repair.

this welding platform is used for reflow logic boards, PRE-Heating logic boards, also used for logic board separation by layers. Removing the gum from the IC chips, Removing and replacing the IC chips.
QianLi Mega-IDEA 3 in 1 pre-heating station is cleverly designed to support all Phone X-XS Max 11-11 Pro Max logic boards, there are no additional molds to buy or use.

Features:
Standalone pre heat / soldering / De-Soldering platform
Work with logic boards on Phone X, XR, XS, XS Max and 11, 11 Pro, 11 Pro Max
Precise targeted temperature
Rapid temperature increase
Non-slip construction with added weight for stability
Digital temperature display
Supports 110V 220V
Compatible with: Phone X/XR/XS/XS Max, Phone 11/1 Pro/11 Pro Max