Descriptions:

White powder, super fine particle size and narrow distribution, high hydrophobicity, high temperature resistance and non-migratory; It is special processed and surface treated to ensure the use in super-thin electronic adhesives, epoxy pouring sealant ( for super-thin FCCL and CCL), electronic ink.

Applications:

1.Excellent hydrolysis resistance, well dispersed and compatible in acetone, butanone, toluene, dichloromethane, N, N-dimethylformamide etc.

2.Especially for high-end applications, such as super-thin flexible copper clad laminate (FCCL), FFC insulating film, FFC reinforcement plate and epoxy resin copper clad laminate (CCL), which require halogen-free, excellent electrical properties and thermostability.

3.It can be used both individually and synergy with other halogen free flame retardant and inorganic filler to reach better flame retardancy and properties of electrical, mechanical and heat resistance. High speed stirring helps better dispersibility for the flame retardants

4.Finished product with LFR-8025 is recyclable.

Specifications

Item	Unit		Specification
Phosphorous content	%(w/w)		23.3-24.0
Bulk density	g/cm3		0.10-0.25
Moisture(K-F)	%(w/w)		≤0.50
Thermal decomposition temperature	℃		300
Particle size(D95)		μm		≤5.0

 

Packaging & Storage:

25kgs in paper-plastic composite bag with PE inliner;

Seal and store in dry, dust-free and cool place;

Shelf life: 12 months.