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Quick Details

Weight: 8500kg
Brand Name: HenggaCNC
CNC or Not: CNC
Type: Surface Grinding Machine
Condition: New
After-sales Service Provided: Engineers available to service machinery overseas
Certification: CE
Dimension(L*W*H): 2600mm*2280mm*1900mm
Power(W): 18kW
Voltage: 380V
Model Number: DM500
Place of Origin: China (Mainland)
Max. Grinding Length: 200mm
Max. Grinding Diameter: 500mm

Specifications

1. Brief Introduction

the CMFK-DM500 is a state-of-the-art brake disc grinding machine from Longkou Hengga Intelligent Equipment Co., Ltd. this double-face grinding machine is tailored for the automotive brake disc processing industry. with a portal column design, vertical workpiece spindle, double tool holder, and vertical grinding spindle, it integrates turning and grinding processes seamlessly. It supports automation through robotic units for loading and unloading or can be operated manually.

2. Technical Parameters

(Note: Specific technical parameters are not detailed in the provided content, but a general outline based on the description includes:)

  • Machine Model: CMFK-DM500
  • Workpiece Diameter Range: 100-450mm
  • Spindle Unit: Taiwan brand, 2000rpm, servo spindle motor
  • Grinding Mode: Double-sided grinding with bowl diamond grinding wheel
  • CNC Control System: Standard GSK, KND (Optional: Siemens, Fanuc, Syntec)
LYV-DM500 data sheet

3. Performance Features
  • Rigid and Stable Structure: Made of thermally symmetrical box-type reinforced cast iron (HT300), minimizing thermal deformation and supporting heavy cutting.
  • High-rigidity Spindle Unit: Features a high-stiffness bearing support structure, ensuring excellent rigidity and high rotational accuracy.
  • Double-column Double-feed Structure: Each column equipped with X, Z, and Y feed axes, ensuring rigid and stable operation.
  • Positioning Accuracy: High-quality Taiwan linear guide rails and ball screws ensure positioning accuracy and repeatability.
  • Torque Self-sensing Grinding Head: Automatically adjusts feed speed based on remaining material, ensuring efficient and stable processing.
  • Chip Removal Design: Vertical and steep sloped design lined with stainless steel chip guide plates reduces thermal deformation and ensures continuous processing accuracy.