Removing Impurities such as photoresist and particulates with chemicals such as ACE,EKC, IPA, etc to Ensure a high level of cleanliness on the wafer surface

Providing a clean surface for subsequent Processes such as photolithography, etching, and coating, thereby reducing the Impact of impurities on these processes and improving the device performance, Yield, and reliability

Highly Efficient and Accurate: Removing Impurities from the wafer surface quickly and precisely by following control Parameters such as temperature, time, and chemical concentration, thus ensuring Process stability and consistency.

High Degree of Automation: Reducing Manual intervention and human error during operation. Designed with multiple Independently working robotic arms.

Function of wafer drying Incorporated.

Cost Reduction: Extends service life of Chemical solution with an effective filtration system.

Safety Features: Equipped with Anti-leakage  protection, temperature Protection, ESD protection, and an automatic fire suppression system.