this machine is with an Automatic control system controlled by lPC( Industrial Personal Computer) and PLC. through the control of RCA cleaning process, the matching application of ultra/mega-sound and the transferring of Multiple robotic arm Systems, the function of " dry in and dry out" is realized, which reduces the Interference of human factors on the cleaning process and meets the target Requirements of wafer surface particle density and surface metal residue.

Modular design of Software and hardware, flexible process design, real-time monitoring Of liquid concentration and  high-efficiency recovery system.

Automatic temperature calibration and over temperature prevention, control Technology of flow Field in tank.

Having many independent Intellectual property rights, optimizing piping to save DIW and solution Consumption, Automatic Scheduling system, concurrent processing of multiple workstations, efficiently.

PC+PLC controlling, Supporting GEM/SECS Interfaces, providing EAP/MES and other functions, supporting SMIF automatic transmission.