No. Program Technical Index 1 Surface processing type Hot air levling, Soft gold, Hard gold HAL, OSP, Immersion gold 2 PCB layer quantity Double-face to 30 layers 3 Minimum lead width 3mil 4 Minimum line space between 3mil 5 Minimum line to tray, tray to tray space between 3mil 6 Minimum drill diameter 0.10mm 7 Minimum hold solder diameter 12mil 8 Max. drill board thick% 1 :12.5 9 Max. molding size 23inch*35inch 10 Molding board thick area 0.21-7.0mm 11 Green ink minimum width 4mil 12 Green ink minimum unilateral Opening 1.5mil 13 Minimum green ink thickness 10um 14 Solder mask type Green, Yellow, Black, Blue or Clarity Sensitization Solder mask, peel off blue glue 15 Minimum character line width 4mil 16 Minimum character height 25mil 17 Silk-screen character color White, Yellow, Black 18 Data file format GERBER file and Corresponding Broach file, PROTEL Series, PADS2000, Powerpcb Series, ODB++ 19 Eletricity performance testing 100% eletricity performance testing；high-pressure testing 20 All kinds board for basic board to PCB processing High Tg board, high frequency board (ROGERS, TEFLON , TACONIC, ARLON), without halogen board, All kinds board press ability 21 Other testing request Impedance testing, hole resistance testing, gold slice up, solder , heat impact and regular security testing 22 Special craft ability Inter hole design, thick copper Multi-layer board