· Miniature size, no down-lead, and ideal for high-density surface mounting requirement

· Ideal for wave and refold soldering

· Superior solder ability and resistance to soldering heat and impact

Application:

· Temperature compensation of semiconductor integrate circuit, LCD, transistor, crystal oscillator of mobile communication equipments

· Temperature detection of rechargeable batteries and CPU

· Temperature compensation of diversified circuits

Specification:

· The range of resistance under the rated zero power (R25℃): 0.1~1000KΩ

· The allowable tolerance of R25℃: ±1%, ±2%, ±3%, ±5%

· The range of B value (K): 3100～4500K

· The allowable tolerance of B value: ±1%, ±2%, ±3%, ±5%

· The range of operating temperature: -40℃ ~ +125℃

· Dissipation factor: ≤1.5mW/℃ (In Still Air)

· Thermal time constant: ≤5S (In Still Air)

· Encapsulated: Chip type

· Dimension: SMD0402, SMD0603, SMD0805