Technologies Requirement:
Layer: 8 layers
Material: FR-4
Thinkness: 1.0mm/1.0T
Finish: Immersion NI/AU

Solder Mask: Green
MIN. Hole size: 0.1mm(4mil)
Min. Line width/space: 0.075/0.075(3mil/3mil)
Special: Blind&burried+ impedance control
Packing: Packing in vaccum