1. Base Board: FR-4, thickness: 0.2-3.0mm, copper weight≤2OZ(70um) 2. Min Line Width: 4mils, Min Hole Size: 0.25mm, BGA treated as taphole without specified note. 3. Technics: Double sided green solder mask, white legend; Surface technics: HAL, Gold Plating, Immersion Gold, Anti-oxidation. 4. Quality standard: IPC-A-600F Class 2 5. E-test: Flying-probe test 6. Cost: Cost mentioned above include engineering, filming, manufacture, test, delivery cost. 7. Lead Time: 4 days