Cu. Electroplating Intermediates:
DPS(N,N-dimethyl-dithiocarbamylpropyl sulfonic acid, sodium salt)(CAS.:18880-36-9)
EDTP(Q75)N,N,N’N’-tetra(2-hydropropyl)ethylene diamine(0-0-0)
H1(2-mercapto thiazoline)(CAS.:96-53-7)
JPH(Aqueous cross-linking polyamide)(0-0-0)
IME(2-mercapto-benzimidazole)(CAS.:68794-57-9)
MPS(3-mercapto-1-propysulfonate, sodium salt)(CAS.:17636-10-1)
N(ethenethiourea)(CAS.:96-45-7)
SPS(Bis-(sodium sulfopropyl) disulfide)(CAS.:27206-35-5)
ZPS(3-S-isothiuronium propyl sulfonate)(CAS.:49625-94-7)
M(2-mercaptobenzimidazole)(CAS.:583-39-1)(CAS.:583-39-1)