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Multilayer High-density PCB with ENIG Surface Treatment/4-layer, Applied on Consumptive Electronics

Six-layer HDI PCB with 1.4mm Board Thickness and Immersion Gold Surface Treatment, Used for Telecom

Multilayer PCB for Mobile Phone Use, Made of FR-4 Material, Laminate Thickness of 15-mil

Multilayer PCB with 1.6mm Board Thickness, FR4 Material and Immersion Gold Finish, Used for Telecom

Multilayer Impedance PCB with Immersion Gold Surface Finish, RoHS Directive-compliant and UL Mark

Multilayer PCB with Immersion Gold Surface Treatment, Applied on Bluetooth Earphones

Four-layer PCB, ENIG Surface Treatment, 1.2mm Thickness, Suitable for Consumer Electronic Products

4-layer PCB with 1.6mm Board Thickness and Immersion Gold Surface Treatment

Multilayer PCB with Gold Plated Surface Treatment Finish and BGA, 2oz Copper Thickness

Four-layer PCB with Immersion Silver Surface Treatment, FR4 Base Material and 1.6mm Board Thickness

Multilayer HDI PCB with Immersion Gold Surface Treatment and 1oz Copper, Used for Telecom

6-layer HDI PCB with Immersion Gold Surface Treatment and 1.0mm Board Thickness

6-layer HDI PCB with Mobile Phone Motherboard, Immersion Gold Surface and Green Solder Mask

6-layered Immersion Gold Board with 0.6mm Board Thickness, Suitable for MP3 and MP4 Players

4-layered Phone Mother Board with Immersion Gold and 10z Copper Thickness

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